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AOI Inspection Systems

Model Name : AOI Series
2D and 3D Inspection Systems, check the IC package conditions before packing.
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Description

DediProg provides different kinds of automatic optical inspection systems. Integrate one of these systems with Dediprog's automated programming system can examine the IC conditions while programming easily, either from the top or from the bottom, 2D or 3D.

 

2D Inspection Options:

  • AOI-63x 
    • Top Inspection
    • Detect marking and orientation
    • Package: QFN, SOP, QFP, etc.
    • Install on DP600-A or Auto Tray-350 Series
    • Device size: All (Except for the CSP that has glossy surface)
    • Camera Resolution: 0.36MP

 

  • AOI-640-B
    •  Bottom Inspection
    • Detect Lead pitch, Lead Skew, lead length, package size, Ball pitch, Ball diameter, Ball count , etc.
    • Package: BGA, CSP, QFN, SOP, QFP, etc.
    • Install on handler
    • Device Size: Above 5mm x 5mm
    • Camera Resolution: 5MP

 

  • AOI-640C-B
    • Bottom Inspection
    • Detect Ball pitch, Ball diameter, Ball count, package size, dirt between, void, pin count, big chipping, etc.
    • Package: CSP & BGA 
    • Install on handler
    • Device Size: Below 5mm x 5mm
    • Camera Resolution: 5MP
       

Advantages of 2D Inspection:

  1. Cost-effective
  2. High speed
  3. Flexible inspection capabilities

 

3D Inspection Options:

  • ANS-68x
    • Bottom Inspection
    • Detect Co-planarity, Lead pitch, Lead Skew, lead length, Ball pitch, Ball diameter, Ball count…ect
    • Package: QFN, SOP, QFP, CSP, BGA
    • Self-Calibration ability
    • Install on handler

 

Advantages of 3D Systems:

  1. Co-planarity inspection capability
  2. Reduced false call rate
  • Stereo Vision Imaging Technology
  • Multi-spectral LED strobe lighting
  • No hardware change-over required between package types
     

 

Product File Type File Description Version Download File size Last Update
AOI Inspection Flyer Flyer AOI Inspection Flyer
New
2024-02-22
IC Part Number Manufacturer Chip Type
Socket Adaptor Package IC Size - Length(mm) IC Size - Width(mm) IC Size - Pitch(mm) Remark