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Pogo Pin

Model Name : Pogo Pin
We specialize in researching and developing Pogo Pin materials and manufacturing processes. Depending on testing requirements, we select appropriate technologies to reduce the overall cleaning frequency and increase the yield in IC testing.
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Function

We specialize in the R&D of Pogo Pin materials and manufacturing processes. By providing advanced material technologies tailored to diverse testing requirements, we help clients enhance IC test yields and reduce overall cleaning frequency. 

We offer full customization for probe specifications including geometry, materials, and spring force, while also providing S-parameter simulation reports.

 


 

Mechanical Spec.

  1. Fine Pitch: 0.15mm  ( Barrel )
  2. Ultra-Short: 1.5mm  ( Free )
  3. Life Time: ~1,000,000 Cycle
  4. Bandwidth: 25GHz @-1dB
  5. Operating Temperature: -55℃~175℃
     

Materials Spec.

  1. BeCu: High Conductivity
  2. M-Pd: Auti-sticking (Sn)
  3. SK4: High Mechanical Strength
     

Plating

  1. Au (Gold): 200Hv; Low resistance and oxidation resistance. Ideal for low-impedance and high-frequency testing.
  2. MP (Palladium Alloy): 650Hv; Low resistance and high wear resistance. Suitable for long-cycle testing and fine-pitch packaging.
  3. Rh (Rhodium): 700Hv; Low resistance and high hardness with excellent wear resistance. Ideal for high-cycle testing and high-hardness solder balls. (Higher cost)
     

 

Structure

Pogo Pin Socket

Pogo Pin Socket

 

Frequently Asked Questions (FAQ)

 

Q: What are the primary applications for Pogo Pins?
Due to their high durability and thermal resistance, Pogo Pins are widely used across semiconductor and electronics manufacturing. Key applications include:

  • IC Functional Test
  • IC Programming
  • PCB / PCBA Testing(ICT / FCT
  • Kelvin Test
  • Burn-in Test
  • Automated Mass Production Testing
  • R&D and Engineering Verification (EVT / DVT)

 

Q: Which IC package types are suitable for Pogo Pin testing?
They are suitable for packages such as WLCSP, BGA, QFN, CSP, LGA, and SOP. Selection depends on pad size, pitch, solder ball height, and material. These factors are balanced with the appropriate probe tip shape, travel distance, and spring force.
 

Q: What is the designable range for spring force?
The standard range is 10g to 50g, with 25g being the most common setting to achieve an optimal balance between contact stability and wear resistance.

 

Q: What is the typical plating thickness for probes?
The standard thickness is 2 μm, which provides an effective balance between electrical conductivity and durability.

 

Q: How is the current-carrying capacity of a probe evaluated?
It depends on the probe's diameter and length. For probes under 5 mm, it can be referenced using this formula:
(OD - 0.1) × 10 = Max Current (A)
For example: 0.31 mm OD ≈ 2.1 A.

 

Read More: The Engineer’s Guide to Pogo Pins: 15 Must-Know Q&As

 


Applicable Items:
Final Test Socket
Open Top Socket
Burn-in Socket


 

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Socket Adaptor Package IC Size - Length(mm) IC Size - Width(mm) IC Size - Pitch(mm) Remark