Browser out of supported, may caused unusable features.

Burn-in Socket

Model Name : Burn-in Socket
DediProg's Burn-in Socket features a modular design, enabling the installation of a heat sink or an ITC module based on the testing requirements.
This item is unavailable for online purchase.


Burn-in Socket

DediProg's Burn-in Socket features a modular design that allows for the installation of a heatsink or ITC module according to testing needs, and includes thermal analysis for close evaluation. It contains high-performance spring-loaded pins that provide stable testing performance across a wide temperature range. For high pin count testing, we also offer a patented labor-saving structure to enhance ease of use.
 


 

SPEC

  1. IC Size: 30 x 30 mm (max.)
  2. Pin Count: ~3,000 Pin
  3. Operating Temp.: -55℃~150℃

 

Contact Element

  1. Pogo Pin
Contact ElementPogo Pin
Life Time ~ 1,000,000 Cycle
Pitch>0.15mm
Temperature-55℃ to 175℃
Bandwidth<25GHz
IC PackageAll IC Package
Ease of RepairLow

 

Material

  1. PEEK-Ceramic
  2. Ultem-2300
  3. Aul.-6061

 


 

Model
 

Model

M2632

M2632-HS

M5060

M5060-HS

Withstand voltage AC 700V For 1 Min. Insulation Resistance 1000MΩ at DC 500V

Outer Diameter

26 x 32mm

26 x 32mm

50 x 60mm

50 x 60mm

IC Size Range

0.8 x 0.8mm ~ 13 x 13mm

0.8 x 0.8mm ~ 13 x 13mm

< 30 x 30mm

< 30 x 30mm

Operation Temperature

-55~150 ℃

Max. Pin Count 

~300 Pin

~300 Pin

~3000 Pin

~3000 Pin

Thermal Power Diss.

~2W

~10W

~10W

~50W

 

HAST (Highly-Accelerated Temperature & Humidity Stress Test)
→ 130°C / 85% at 480hrs    
HTOL (High Temperature Operating Life Test)
 → 150°C at 1000hrs 
LTOL (Low Temperature Operating Life Test)
→ -55°C at 1000hrs

 


 

Structure

 

Model: M5060 / M7080 Burn-in Socket

M5060 / M7080 Burin-in Socket

 

Model: M2632 Burn-in Socket

M2632 Burin-in Socket

 


Frequently Asked Questions (FAQ)

 

Q: What are the primary applications for Burn-in Sockets?
Burn-in Sockets are engineered for high-reliability IC testing, providing a robust solution for high-temperature, high-current, and extended-duration operation. They ensure IC durability and operational stability, delivering consistent chip quality for production and shipment.
 

Q: What are the key features of Burn-in Sockets?
Designed for continuous high-temperature and high-current operation, Burn-in Sockets securely hold ICs while maintaining uniform contact pressure. Integrated thermal management capabilities support efficient heat dissipation, ensuring stable electrical performance and signal integrity throughout the testing process.
 

Q: What materials are used in Burn-in Sockets?
Standard Burn-in Sockets utilize high-temperature engineering plastics that deliver dimensional stability, mechanical robustness, and long-term reliability under prolonged thermal and electrical stress. Contact elements are typically high-wear metals or plated probes for consistent connectivity. For high-frequency or high-power ICs, specialized plastics with low dielectric constants or enhanced thermal conductivity are employed to optimize signal fidelity and heat dissipation.
 

Q: What are the advantages of a modular Burn-in Socket design?
Modular Burn-in Socket architecture accelerates new product introduction, improves manufacturing efficiency, and ensures consistent, reliable testing performance. Under high-temperature, high-current, and extended-duration conditions, modular sockets deliver repeatable, high-fidelity test results.
 


GET IN TOUCH

Achieve flawless IC testing with the perfect solution tailored for you.

           

Product File Type File Description Version Download File size Last Update
IC Part Number Manufacturer Chip Type
Socket Adaptor Package IC Size - Length(mm) IC Size - Width(mm) IC Size - Pitch(mm) Remark