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Final Test Socket

Model Name : Final Test Socket
Final Test Sockets can be applied to various types of testing environments, including high-frequency, high-speed transmission, and wide-temperature range testing. The Pogo pin utilize special material technology, significantly improving the test yield.
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Function

The final test socket features high-performance pogo pins and durable engineering plastic, ensuring extensive bandwidth, a wide temperature range, and an extended product lifespan. You can choose a socket lid from the knob, double latch, or single latch types.

The final test socket can be customized according to the chip performance, package type, and testing environment. This model is suitable for various testing environments, including high-frequency, high-speed transmission, and wide temperature range tests. The pogo pins use specialized material technology, significantly improving test yield. 
 

 

SPEC

  1. Pitch: 0.20mm (min. )
  2. IC Size: 50 x 50 mm (max.)
  3. Pin Count: ~3,500 Pin
  4. Bandwidth: 25GHz@-1dB
  5. Operating Temp. : -55℃~150℃

 

Contact Element

  1. Pogo Pin
  2. Rubber ( PCR )
Contact ElementPogo PinPCR
Life Time~ 1,000,000 Cycle50,000 ~ 100,000 Cycle
Pitch>0.15mm>0.30mm
Temperature-55℃~175℃-55°C ~ 135°C
Bandwidth<25GHz>60GHz
IC PackageAll IC PackageBGA、LGA、QFN
Ease of RepairLowHigh

 

Material

  1. PEEK-Ceramic
  2. Torlon-5030 (4XG)
  3. EKH-SS11
  4. SCP-5000
  5. Aul.-6061 
     

 

Model

 

Clamshell with blockClamshell with knobDual-latch knob

Suitable for QFN and BGA packages with < 300 pins.

Suitable for QFP, SOP, and BGA packages with >300 pins.

Preferred for machine testing of QFP, SOP, and BGA packages with > 300 pins.

 

 

Structure

 

Final Test Socket

Final Test Socket

 

Frequently Asked Questions (FAQ)

 

Q: What are the primary applications for Final Test Socket?
FT Sockets are used in functional testing scenarios that require fast insertion and removal, as well as repeated verification of IC functionality and performance.
 

Q: What are the key features of Final Test Sockets?
FT Sockets emphasize reliable electrical contact and low-impedance signal transmission. They are designed to withstand high-speed testing and high-cycle operation, ensuring signal integrity throughout the test process.
 

Q: What materials are typically used in Final Test Sockets?
FT Sockets are manufactured using high-hardness engineering plastics to prevent deformation, wear, or aging during high-speed and high-cycle testing, while maintaining signal integrity and long-term reliability.
 

Q: Do Final Test Sockets support thermal/cooling design?
Some FT Sockets can be integrated with thermal management designs based on actual test power and thermal conditions, such as thermal interface materials or air/ liquid cooling mechanisms. These solutions help reduce temperature rise during testing, improve test stability, and ensure the reliability of both the IC and the socket under prolonged or high-power test conditions.
 

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