Description

DP3000-G3 automated IC chip device programming system is the third generation of DP3000. It is able to support CSP packages as well as small size packages, like 1.5 x 0.8mm size chips. DP3000-G3 supports different input/output peripherals, like tube, tape, and tray, to provides an overall solution for IC chip device programming with more advanced features. 

DP3000-G3 supports all kinds of IC families, such as EEPROM, NAND/NOR FLASH, MCU, eMMC, and UFS, etc. It is able to expand up to 96 programming sites, which will keep the high throughput even when handling the high-density memory,  like NAND Flash, eMMC, and UFS.

Features

• Support All IC Families and different Input/Output Peripherals
  • Input/Output: Tube, Tape, and Tray.
  • Supported IC: EEPROM, NAND/ NOR FLASH, MCU, eMMC, and UFS, etc.
  • Supported IC Package: SOP, SSOP, TSSOP, PLCC, QFN, LQFP, BGA, and WLCSP, etc. 
• High Expansibility
  • Able to embed up to six sets of eMMC-S8 or ProgMaster-S8 or NuProgPlus to get up to 96 sites.
• Adjustable Socket Actuating Kit
• High Throughput, up to 3,600 UPH
• Software Support NAND FLASH Bad Block Skip and Partition Programming
• Software Support Work Project
• DediProg Auto Teach Feature
  • Proceduralize- Automatically adjust the handler’s parameters step by step.
  • Digitalized- Automatically adjust the heights of nozzles.
  • Increase the speed of system adjustment.
  • Self-detection Function- Increase the accuracy & stabilities for nozzle pick and place.
• MES (Manufacturing Execution System) 
  • DediProg handlers are able to apply to different MES; production line via API protocol is easy to be integrating with their internal server. Work report can be converted to excel file as a record.
• Various Additional Functions
  • Laser, Label Printer, Inkjet Marker, and 3D Inspection.