The final test socket is equipped with high-performance pogo pins and engineering plastic, achieving the goal of extensive bandwidth, wide temperature range, and extended product lifespan. The socket Lid can be chosen from the knob, double latch, or single latch type.
The final test socket can be customized based on the chips' performance, the packages' types, and the testing environment.
◆ Outer Diameter: 25mm x 25mm~ 68mm x68mm
◆ IC Size Range: 0.5mm x 0.5mm~ 55mm x 55m
◆ Applicable PAD Pitch: 0.35mm~2.54mm
◆ Withstand voltage: AC 100V For 1 Minute
◆ Insulation Resistance: 1000MΩ
◆ Contact Resistance: 100mΩ (AVG)
◆ Operation Temperature: -55℃~150℃
◆ Insertion : 200,000 Cycle (Mechanical)
◆ Bandwidth : >25 GHz@-3dB
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