Date: June 13 – 15, 2018
SMX Convention Center, Manila, Philippines
Booth: 234 at Hall 3
Presentation Subject: Wafer Level CSP/BGA Programming Solution
Presentation Time: June 13 at 3:30 PM in Area 1.
We are back to PSECE again!
This time, we will be presenting our second generation DP1000 with tray and tape peripherals. DP1000-G2 is faster and more stable than the first generation. The throughput has increased up to 1650. Also, we will be giving a presentation of Wafer Level CSP/BGA Programming Solution! We are pleased to welcome you to our booth to discuss any programming questions!
AOI Inspection, UFS/eMMC programming, ICP/ISP Programming, DP1000-G2 High-speed Automated Programming System, Auto Tray Loader, and Auto Taping System.